Surface mount technology(SMT) is now the standard way of manufacturing in electronics industry. By using surface mount technology, electronics can be created in a safer environment, and since process is simpler, the electronics can be manufactured faster. However, this method is extremely sensitive to the environment around it. If not performed in an extremely controlled environment, surface mount technology will not be effective.
Applying N2 gas in reflow solder systems is sometimes debated by assembly companies, weighing the cost of investing in nitrogen-producing equipment or buying stored gas. But few assemblers will argue that the use of an inert atmosphere such as N2 can not only improve solder joint quality and manufacturing yields but also reduce sensitivity to SMT manufacturing process variations. In effect, the use of nitrogen during assembly and packaging helps to widen the process window, resulting in a boost in manufacturing yield.
Oxygen and resulting oxidation can weaken the solder, so Nitrogen gas produced by Onsite PSA Nitrogen Generator is applied to maintain a clean, dry and inert atmosphere during the process to create a strong and lasting bond.